Qualcomm, well known for both its radio chipsets and processors, is announcing today that its latest Gobi chipsets -- the MDM9225 and MDM9625 -- are capable of LTE Advanced and Carrier Aggregation for higher data speeds. Carrier Aggregation (which isn't what you'd think) is a technology that allows the LTE radio in a device to pull down data across multiple bands of spectrum. This means that a device could simultaneously receive data over two (or more) different frequencies, combining it to give data speeds similar to what it would be over a larger chunk of a single frequency. For example, if a carrier has deployed 10MHz of spectrum in one frequency and 10MHz in another, the chip could combine those two and give users the same experience as if the carrier had deployed 20MHz of continuous spectrum in one band.
This is some nerdy radio stuff, but the end result is very important. There's a lot of spectrum out there, but it's not always allocated to each operator in the most efficient way. As networks transition between older 3G technologies and LTE, the spectrum may not be allocated in complete 20MHz blocks for use by a single network. These new Qualcomm chips let devices connect to these disjointed bands simultaneously.
These new MDM9x25 chips are manufactured using a 28nm (nanometer) process, and offer LTE Advanced with downlink speeds up to 150mbps on top of extensive 2G and 3G (including DC-HSPA+) support all in one chip. The process has already been shown off inside of a Sierra Wireless mobile hotspot, and Qualcomm says that OEM partners began sampling the chips in November of last year to make it into consumer products in late 2013.
 |  |
Source: http://feedproxy.google.com/~r/androidcentral/~3/ihQa2SHRIYo/story01.htm
AMPHENOL ANIXTER INTERNATIONAL APPLE COMPUTER APPLIED MATERIALS
No comments:
Post a Comment